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Lightmatter Packaging Architect / Lead Engineer (Boston) in Boston, Massachusetts

Lightmatter is redefining what computers and human beings are capable of by delivering a fundamentally new kind of computer that calculates using light. Transistors, the workhorse of modern computers, aren't improving at the rate they once were. To scale AI, companies are building increasingly large and energy-expensive data centers—a path that is neither financially nor environmentally sustainable. By delivering ultra-high performance and energy efficiency, Lightmatter’s compute engine will power rapid advancements in AI while lowering its environmental footprint. We are inviting a Packaging Architect / Lead Engineer to our team.

You will be working with a cross-functional team of chip designers, architects, packaging & supply chain members to define the package architecture from inception, through design optimization and completion. The results of your work will define leading-edge packaging solutions that meet the product performance targets with respect to bandwidth power, lead to market introduction of leading AI chips, and enable business growth with leading customers in the data centers and high-end compute segment.

Responsibilities:

  • You will be responsible for developing packaging solutions from inception to product release while leading cross-functional teams across substrate design, signal and power integrity, thermal-mechanical, systems engineering & manufacturing.

  • You will be interfacing with product architects, chip designers and system architects to distill and compile product needs and translate them into packaging requirements while identifying and aligning the appropriate packaging solution to meet the performance, cost and schedule expectations of the product.

  • Lead & oversee all package electrical characterizations and work closely with layout engineers to define package attributes, including the form-factor, stack-up, pin count, pinout, and optimum routing schemes with considerations to manufacturing constraints and performance targets.

  • You will lead and oversee the thermal-mechanical solution development for the silicon-package stack including the socket and the loading mechanism for the product.

  • Partner and align with supply chain engineering experts to identify & align packaging technology and materials requirements for substrate fabrication, assembly and raw material vendors while interfacing with Q&R.

  • You will need to understand emerging architectures through close collaboration with the product team and customers across the data center and high-end compute segments while maintaining a deep understanding of the competitive landscape.

Requirements

  • Ph.D or Masters in Electrical Engineering, Mechanical Engineering, Material Science or related field

  • 15+ years of experience in characterization and design of 2D, 2.5D, & 3D flip-chip & wafer-scale packaging solutions

  • 10+ years of experience in the areas of power-signal integrity, thermal-mechanical & system engineering domains.

  • 10+ years of experience in project/product execution & management

  • Proven track record of bringing up successful package/ product with high power and high bandwidth applications from inception to product introduction

  • Working knowledge of various high speed interfaces such as SERDES, PCIe, and D2D interfaces and well versed with various EDA & CAD tools

  • Experience with HBM on package integration, DDR integration & working knowledge of various memory types

  • Excellent communication skills and ability to work well in cross functional teams and external suppliers

  • Proven track record in technical leadership of complex product development under challenging technical and schedule conditions

  • Ability to work independently and tackle projects with minimum supervision

  • Creative thinker, have the ability to solve problems quickly

Benefits

  • Comprehensive Health Care Plan (Medical, Dental & Vision)

  • 401k matching

  • Life Insurance (Basic, Voluntary & AD&D)

  • Generous Time Off (Vacation, Sick & Public Holidays)

  • Paid Family Leave

  • Short Term & Long Term Disability

  • Training & Development

  • Flexible, hybrid workplace model

  • Stock Option Plan

Lightmatter recruits, employs, trains, compensates and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.

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